DocumentCode
3294047
Title
Creating 35 mm camera active pixel sensors
Author
Chapman, Glenn ; Audet, Yves
Author_Institution
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
fYear
1999
fDate
36465
Firstpage
22
Lastpage
30
Abstract
A 36×24 mm active pixel sensor imaging area device is studied which would be ideal for use with standard 35 mm cameras. By applying multichip methods to active pixel sensors, the 39×30 mm system contains on board all the control circuitry and A/D converters, so the system outputs digital data. The large area requires a redundancy of design for a high yield. This starts with the active pixel cell, which able to withstand several defects and still be repairable, which CCD cells are not. The whole system is targeted at preventing bad rows or columns. By using spares in the row and column circuitry, as well as spare A/D converters the chip yield is only limited by a relatively small logic and control block. With repairs the yield of this 11.7 sq. cm system goes from almost nil to more than 80%-93% with modest defect densities of 1.5 to 0.5 per sq. cm. By being a retrofit for current 35 mm cameras, and having larger photodiode pixels than current APS´s this CMOS device would be nearly as sensitive as CCD´s but at much lower production costs and much higher yields
Keywords
CMOS image sensors; analogue-digital conversion; integrated circuit yield; multichip modules; photodiodes; redundancy; 24 mm; 36 mm; A/D converters; CMOS device; active pixel sensors; bad columns; bad rows; chip yield; defect densities; multichip methods; photodiode pixels; production costs; redundancy; CMOS image sensors; Cameras; Charge coupled devices; Control systems; Image sensors; Logic circuits; Photodiodes; Pixel; Production; Sensor systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 1999. DFT '99. International Symposium on
Conference_Location
Albuquerque, NM
ISSN
1550-5774
Print_ISBN
0-7695-0325-x
Type
conf
DOI
10.1109/DFTVS.1999.802865
Filename
802865
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