DocumentCode
3294172
Title
Hysteresis modeling and compensation for an XY micropositioning stage with model reference adaptive control
Author
Li, Yangmin ; Xu, Qingsong
Author_Institution
Dept. of Electromech. Eng., Univ. of Macau, Macau, China
fYear
2009
fDate
15-18 Dec. 2009
Firstpage
5580
Lastpage
5585
Abstract
In this paper, a model reference adaptive controller (MRAC) is designed for a piezo-driven XY parallel micropositioning stage to compensate for the hysteresis effects aiming at a sub-micron accuracy motion tracking control. To convert the desired motion trajectory into voltage input, the inverse modified Prandtl-Ishlinskii (PI) hysteresis model is employed. The modified PI model is identified by optimizing the weight parameters through particle swarm optimization (PSO) to match the model output to experimental data. To compare with other methods, a feedforward controller based on PI model is implemented as well. The performances of MRAC and feedforward controllers are examined by extensive simulation studies. Results show that the former is superior to the latter one in terms of steady state errors especially as the increasing of input rates. Besides, the robustness of MRAC controller with rejection to external disturbances is verified as well.
Keywords
adaptive control; compensation; feedforward; hysteresis; micropositioning; motion control; particle swarm optimisation; piezoelectric actuators; Prandtl-Ishlinskii hysteresis model; compensation; feedforward controller; hysteresis modeling; model reference adaptive controller; motion tracking control; motion trajectory; particle swarm optimization; piezo-driven XY parallel micropositioning stage; steady state errors; Adaptive control; Hysteresis; Impedance matching; Motion control; Particle swarm optimization; Programmable control; Robust control; Steady-state; Tracking; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Decision and Control, 2009 held jointly with the 2009 28th Chinese Control Conference. CDC/CCC 2009. Proceedings of the 48th IEEE Conference on
Conference_Location
Shanghai
ISSN
0191-2216
Print_ISBN
978-1-4244-3871-6
Electronic_ISBN
0191-2216
Type
conf
DOI
10.1109/CDC.2009.5399586
Filename
5399586
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