FEM analysis of SnAgCu solder joint in flip chip

Author

Yongchang Yan ; Li, Xiaoyan ; Liu, Na

Author_Institution

Sch. of Mater. Sci. & Eng., Beijing Univ. of Technol., Chaoyang, China

fYear

2009

fDate

6-10 July 2009

Firstpage

418

Lastpage

422

Abstract

SnAgCu solder is fast becoming a reality in electronic manufacturing during to marketing and legislative pressure. This paper studies the thermal fatigue life of flip chip by the application of thermal fatigue life prediction model. The required life prediction model for SnAgCu solder joint is based on fatigue-creep interaction damage theory. In same test condition, the actual life of flip chip is earned from the other paper. The different between the actual life and prediction life will be compared, and the reason of difference will be analyzed.

Keywords

creep; finite element analysis; flip-chip devices; solders; thermal stress cracking; tin compounds; FEM analysis; SnAgCu; electronic manufacturing; fatigue-creep interaction damage theory; flip chip; solder joint; thermal fatigue life prediction model; Creep; Environmentally friendly manufacturing techniques; Fatigue; Flip chip; Lead; Materials science and technology; Predictive models; Soldering; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the

Conference_Location

Suzhou, Jiangsu

ISSN

1946-1542

Print_ISBN

978-1-4244-3911-9

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2009.5232617

Filename

5232617