Title :
FEM analysis of SnAgCu solder joint in flip chip
Author :
Yongchang Yan ; Li, Xiaoyan ; Liu, Na
Author_Institution :
Sch. of Mater. Sci. & Eng., Beijing Univ. of Technol., Chaoyang, China
Abstract :
SnAgCu solder is fast becoming a reality in electronic manufacturing during to marketing and legislative pressure. This paper studies the thermal fatigue life of flip chip by the application of thermal fatigue life prediction model. The required life prediction model for SnAgCu solder joint is based on fatigue-creep interaction damage theory. In same test condition, the actual life of flip chip is earned from the other paper. The different between the actual life and prediction life will be compared, and the reason of difference will be analyzed.
Keywords :
creep; finite element analysis; flip-chip devices; solders; thermal stress cracking; tin compounds; FEM analysis; SnAgCu; electronic manufacturing; fatigue-creep interaction damage theory; flip chip; solder joint; thermal fatigue life prediction model; Creep; Environmentally friendly manufacturing techniques; Fatigue; Flip chip; Lead; Materials science and technology; Predictive models; Soldering; Testing; Tin;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232617
