Title :
Thermal analysis of DC/DC module
Author :
Yuanchun, Wang ; Weidong, Ma ; Changzhi, Lv ; Zhiguo, Li ; Chunsheng, Guo ; Fei, Li
Author_Institution :
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
Ever-increasing DC/DC power density and peak temperature challenge its reliability and performance. Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design. This paper presents an accurate and fast approach to simulate the thermal distribution of a DC/DC module. The thermal distribution is simulated with ANSYS, and verified by infrared thermal images. This made feasible the thermal design to reduce stressing temperature peaks, so improving DC/DC reliability significantly.
Keywords :
integrated circuit packaging; modules; thermal analysis; DC-DC module; DC-DC package design; infrared thermal images; power density; thermal analysis; thermal distribution simulation; Analytical models; DC generators; Infrared imaging; Packaging; Temperature; Thermal stresses;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232619
