DocumentCode
3294347
Title
Investigation of engineering fallout caused by package design marginality
Author
Goh, L.L. ; Liew, C.N.
Author_Institution
Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
fYear
2009
fDate
6-10 July 2009
Firstpage
377
Lastpage
380
Abstract
This paper had highlighted the packaging design marginality that causing high yield loss in engineering lot. By employing the logic of failure analysis, coupled with a series of conventional sample preparation and inspection methodologies, the effort lead to a full understanding of the failure mechanism that salvaged batches of materials from being assembled.
Keywords
failure analysis; packaging; reliability; engineering fallout; failure analysis; package design marginality; sample inspection; sample preparation; Assembly; Circuit testing; Design engineering; Electrical equipment industry; Failure analysis; Inspection; Integrated circuit packaging; Manufacturing industries; System testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232627
Filename
5232627
Link To Document