DocumentCode :
3294444
Title :
Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
Author :
Chien, Chen-Fu ; Hsu, Chia-Yu ; Chou, Hong-Shing ; Lin, Chih-Wei
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsinchu
fYear :
2006
fDate :
25-27 Sept. 2006
Firstpage :
317
Lastpage :
320
Abstract :
Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor manufacturing. However, little research has been done to address productivity from the perspective of wafer exposure performance. This study aims to propose a novel standard, overall wafer effectiveness (OWE), to evaluate the effectiveness of wafer exposure rather than only considering tool productivity. Furthermore, the proposed OWE can be easily extended to incorporate additional attributes such as throughput, yield, and price. In particular, a weighted OWE that integrates mask field utilization and OWE is illustrated with numerical example to show the practical viability of OWE as a semiconductor industry standard to drive collaborative efforts among IC designers, equipment vendors, and manufacturers for enhancing total wafer effectiveness.
Keywords :
productivity; semiconductor device manufacture; standards; collaborative efforts; industry standard; overall wafer effectiveness; semiconductor manufacturing; tool productivity; wafer productivity; Availability; Collaboration; Electronics industry; Extraterrestrial measurements; Manufacturing industries; Particle measurements; Performance analysis; Performance loss; Productivity; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-4-9904138-0-4
Type :
conf
DOI :
10.1109/ISSM.2006.4493094
Filename :
4493094
Link To Document :
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