A high resolution and early triggering on multi layer processing defects

Author

Chan, Seong Choong ; Chin, Aaron ; Liew, Patrick ; Wang, Xiang ; Ho, Eng Keong

Author_Institution

Syst. on Silicon Manuf. Co. Pte Ltd, Singapore

fYear

2006

fDate

25-27 Sept. 2006

Firstpage

332

Lastpage

333

Abstract

In this paper, we discussed the methodology of multi layers defect monitoring using probability of occurrence (p) instead of average value. We also show how the probability of occurrence (p) is able to early trigger a defectivity event thus preventing major yield impact compare to average value.

Keywords

condition monitoring; semiconductor device manufacture; semiconductor device reliability; defect monitoring; defectivity event; multilayer processing defects; occurrence probability; Chaos; Drives; Event detection; Inspection; Manufacturing industries; Manufacturing processes; Monitoring; Pulp manufacturing; Semiconductor device manufacture; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

978-4-9904138-0-4

Type

conf

DOI

10.1109/ISSM.2006.4493098

Filename

4493098

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3294511