Title :
A high resolution and early triggering on multi layer processing defects
Author :
Chan, Seong Choong ; Chin, Aaron ; Liew, Patrick ; Wang, Xiang ; Ho, Eng Keong
Author_Institution :
Syst. on Silicon Manuf. Co. Pte Ltd, Singapore
Abstract :
In this paper, we discussed the methodology of multi layers defect monitoring using probability of occurrence (p) instead of average value. We also show how the probability of occurrence (p) is able to early trigger a defectivity event thus preventing major yield impact compare to average value.
Keywords :
condition monitoring; semiconductor device manufacture; semiconductor device reliability; defect monitoring; defectivity event; multilayer processing defects; occurrence probability; Chaos; Drives; Event detection; Inspection; Manufacturing industries; Manufacturing processes; Monitoring; Pulp manufacturing; Semiconductor device manufacture; Silicon;
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-4-9904138-0-4
DOI :
10.1109/ISSM.2006.4493098
