Title :
The relationship between LED package and reliability
Author :
Guoguang, Lu ; Yun, Huang ; Yunfei, En ; Shaohua, Yang ; Zhifeng, Lei
Author_Institution :
Key Lab. for Reliability Phys. & Applic. Technol. of Electr. Component, China Electron. Product Reliability & Environ. Testing Res. Inst., China
Abstract :
Package is a key factor, and affects the reliability of LED. In this paper, the main failure modes and mechanisms that caused by poor package process were investigated through some failure analysis cases, and some improving methods to improve the LED´s reliability are put forward.
Keywords :
failure analysis; light emitting diodes; semiconductor device packaging; semiconductor device reliability; LED package; LED reliability; failure analysis; failure modes; Curing; Electronics packaging; Failure analysis; LED lamps; Light emitting diodes; Liquid crystal displays; Microassembly; Semiconductor device packaging; Temperature; Thermal stresses;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232642
