DocumentCode
3294632
Title
The relationship between LED package and reliability
Author
Guoguang, Lu ; Yun, Huang ; Yunfei, En ; Shaohua, Yang ; Zhifeng, Lei
Author_Institution
Key Lab. for Reliability Phys. & Applic. Technol. of Electr. Component, China Electron. Product Reliability & Environ. Testing Res. Inst., China
fYear
2009
fDate
6-10 July 2009
Firstpage
323
Lastpage
326
Abstract
Package is a key factor, and affects the reliability of LED. In this paper, the main failure modes and mechanisms that caused by poor package process were investigated through some failure analysis cases, and some improving methods to improve the LED´s reliability are put forward.
Keywords
failure analysis; light emitting diodes; semiconductor device packaging; semiconductor device reliability; LED package; LED reliability; failure analysis; failure modes; Curing; Electronics packaging; Failure analysis; LED lamps; Light emitting diodes; Liquid crystal displays; Microassembly; Semiconductor device packaging; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232642
Filename
5232642
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