Title :
Effect of textures on elastic constants of Cu thin films
Author_Institution :
Sch. of Mater. Sci. & Eng., Univ. of Sci. & Technol. Beijing, Beijing, China
Abstract :
Due to their influence on the mechanical properties, residual stresses in thin films have become an important topic in materials science. The elastic constants are required to determine the residual stresses using X-ray diffraction method. The elastic constants of Cu thin films with ideal fibre textures were calculated using the Voigt, Reuss and Hill model in the present work. The results show that the elastic constants are strongly dependent on their textures. When textures exist within Cu thin films, the matrix of the elastic constants converted from cubic symmetry to hexagonal symmetry. In order to analyze the effect of the textures on the elastic constants of Cu thin films quantitatively, the relationship between the elastic constants and textures was derived by the orientation distribution function.
Keywords :
X-ray diffraction; copper; elastic constants; integrated circuit interconnections; internal stresses; metallic thin films; Cu; X-ray diffraction method; copper thin films; cubic symmetry; elastic constants; hexagonal symmetry; ideal fibre textures; orientation distribution function; residual stresses; Crystallization; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Materials science and technology; Metallization; Residual stresses; Thin film circuits; Transistors; X-ray diffraction;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232652