Title :
Study on PoP (package-on-package) Assembly Technology
Author :
Yang, Hong Zhen ; Li, Guo Hong ; Cao, Xin Yu
Author_Institution :
North China Inst. of Aerosp. Eng., Lang fang, China
Abstract :
This paper analyzes the main factors that affect PoP assembly process quality, and proposes solutions to these problems. The technology is simple, easy-to-use, flexible, and controllable. This technology can make use of the existing SMT equipment, can lower production costs and improve production efficiency and yield.
Keywords :
assembling; ball grid arrays; PoP assembly technology; SMT equipment; ball grid array packages; package-on-package; process quality; production costs; production efficiency; Assembly; Chip scale packaging; Digital cameras; Electronic packaging thermal management; Electronics packaging; Logic devices; Logic testing; Personal digital assistants; Production; Sprites (computer);
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232653
