DocumentCode
3294895
Title
Reliable High Volt Mixed Signal IC Manufacturing
Author
Naughton, John J. ; Tyler, Matthew ; Anser, Muhammad
Author_Institution
AMI Semicond., Pocatello
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
407
Lastpage
410
Abstract
Systematic variations of standard n-channel field dopant concentrations and diffusion to well layout rules have been an industry standard for building LDMOS devices. Using this systematic approach, the determined BV can be customized for a given circuit need. This LDMOS can also be used to trigger a custom ESD protection structure. Structures without gate oxide further enhance their reliability during multiple ESD events. Arranging these structures in a radially symmetric array with centralized bond pads provide space efficient protection for multiple voltage domains, improved signal isolation, electromagnetic compatibility, and Vt1 immunity to process variation. T-cad simulations can be used to determine these layout rules prior to actual silicon.
Keywords
MIS devices; electrostatic discharge; integrated circuit manufacture; reliability; ESD protection structure; LDMOS devices; centralized bond pads; electromagnetic compatibility; high volt mixed signal IC manufacturing; multiple voltage domains; Bonding; Buildings; Circuits; Electromagnetic compatibility; Electrostatic discharge; Manufacturing industries; Protection; Signal processing; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493121
Filename
4493121
Link To Document