• DocumentCode
    3294895
  • Title

    Reliable High Volt Mixed Signal IC Manufacturing

  • Author

    Naughton, John J. ; Tyler, Matthew ; Anser, Muhammad

  • Author_Institution
    AMI Semicond., Pocatello
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    407
  • Lastpage
    410
  • Abstract
    Systematic variations of standard n-channel field dopant concentrations and diffusion to well layout rules have been an industry standard for building LDMOS devices. Using this systematic approach, the determined BV can be customized for a given circuit need. This LDMOS can also be used to trigger a custom ESD protection structure. Structures without gate oxide further enhance their reliability during multiple ESD events. Arranging these structures in a radially symmetric array with centralized bond pads provide space efficient protection for multiple voltage domains, improved signal isolation, electromagnetic compatibility, and Vt1 immunity to process variation. T-cad simulations can be used to determine these layout rules prior to actual silicon.
  • Keywords
    MIS devices; electrostatic discharge; integrated circuit manufacture; reliability; ESD protection structure; LDMOS devices; centralized bond pads; electromagnetic compatibility; high volt mixed signal IC manufacturing; multiple voltage domains; Bonding; Buildings; Circuits; Electromagnetic compatibility; Electrostatic discharge; Manufacturing industries; Protection; Signal processing; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493121
  • Filename
    4493121