• DocumentCode
    3295130
  • Title

    High-temperature Conductive-AFM technique for resolution of soft failures

  • Author

    Huat, Lim Soon ; Wanxin, Sun ; Narang, Vinod ; Chin, J.M.

  • Author_Institution
    Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore, Singapore
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    204
  • Lastpage
    207
  • Abstract
    This paper demonstrates the Veeco heating stage for high temperature Conductive-AFM analysis which is very useful for revealing leaky contacts associated with soft failures. CAFM at 80degC is performed on SOI transistors to isolate leaky polysilicon gate contacts. Nanoprobing at high temperature is performed and it shows strong correlation with the high temperature CAFM data. High temperature CAFM helped to isolate higher gate oxide leakage current in the failing transistor in SRAM memory cell.
  • Keywords
    atomic force microscopy; failure analysis; high-temperature techniques; silicon-on-insulator; SOI transistor; Veeco heating stage; high temperature conductive-AFM analysis; high-temperature conductive-AFM technique; leaky contacts; leaky polysilicon gate contacts; nanoprobing; soft failures; Circuit testing; Failure analysis; Humidity; Packaging; Research and development; Semiconductor device reliability; Sockets; Substrates; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232667
  • Filename
    5232667