DocumentCode
3295130
Title
High-temperature Conductive-AFM technique for resolution of soft failures
Author
Huat, Lim Soon ; Wanxin, Sun ; Narang, Vinod ; Chin, J.M.
Author_Institution
Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore, Singapore
fYear
2009
fDate
6-10 July 2009
Firstpage
204
Lastpage
207
Abstract
This paper demonstrates the Veeco heating stage for high temperature Conductive-AFM analysis which is very useful for revealing leaky contacts associated with soft failures. CAFM at 80degC is performed on SOI transistors to isolate leaky polysilicon gate contacts. Nanoprobing at high temperature is performed and it shows strong correlation with the high temperature CAFM data. High temperature CAFM helped to isolate higher gate oxide leakage current in the failing transistor in SRAM memory cell.
Keywords
atomic force microscopy; failure analysis; high-temperature techniques; silicon-on-insulator; SOI transistor; Veeco heating stage; high temperature conductive-AFM analysis; high-temperature conductive-AFM technique; leaky contacts; leaky polysilicon gate contacts; nanoprobing; soft failures; Circuit testing; Failure analysis; Humidity; Packaging; Research and development; Semiconductor device reliability; Sockets; Substrates; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232667
Filename
5232667
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