• DocumentCode
    3295231
  • Title

    Managing Dynamic Events in Full-Load States of Semiconductor Manufacturing Chains

  • Author

    Huang, Hsin-Yi ; Chang, Sherman ; Chen, Jun-Wei ; Chou, Yon-Chun

  • Author_Institution
    Nat. Taiwan Univ., Taipei
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    491
  • Lastpage
    494
  • Abstract
    Semiconductor manufacturing is a complicated operation that is plagued by all sorts of uncertainties in process yield, equipment reliability, IC demands and product mixes. This paper describes a new proactive planning method for responding to dynamic events that pose a threat to degenerate the supply services of manufacturing chains. A dynamic system model for manufacturing chains under exogenous demand shocks is first described. As the impact of dynamic events is the most severe when manufacturing chains are in the full-load state, a procedure is next presented for constructing full-load production functions of flexible capacity. The third part of this paper develops an optimal control model for integrating the production functions of multiple production units. Given an inordinary event of demand shock, this model can be used to determine if the shock can be absorbed by the manufacturing chains without degrading its fulfilment services. Numerical examples are given to demonstrate the working of the method.
  • Keywords
    integrated circuit manufacture; optimal control; IC demands; exogenous demand shocks; full-load production functions; managing dynamic events; optimal control model; proactive planning method; semiconductor manufacturing chains; Electric shock; Flexible manufacturing systems; Manufacturing processes; Optimal control; Production; Pulp manufacturing; Semiconductor device manufacture; Semiconductor device reliability; Uncertainty; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493144
  • Filename
    4493144