DocumentCode :
3295337
Title :
A simulation study of source/drain-tie effects on characteristics of self-aligned π-shaped source/drain ultrathin SOI FETs
Author :
Eng, Yi-Chuen ; Lin, Jyi-Tsong ; Chang, Tzu-Feng ; Kuo, Chih-Hao ; Lin, Po-Hsieh ; Sun, Chih-Hung ; Chiu, Hsien-Nan ; Chen, Hsuan-Hsu
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fYear :
2009
fDate :
6-10 July 2009
Firstpage :
169
Lastpage :
173
Abstract :
This paper aims to investigate the performance and reliability trade-off of the self-aligned (SA) pi-shaped source/drain (S/D) ultrathin silicon-on-insulator (UTSOI) field-effect transistors (FETs). Based on the simulations, the S/D-tie effects are crucial to the future of quasi-SOI devices. The preliminary results of electrical characteristics of the SA-piFETs are carefully demonstrated.
Keywords :
field effect transistors; semiconductor device reliability; silicon-on-insulator; reliability trade-off; self-aligned pi-shaped source/drain ultrathin SOI FETs; self-aligned pi-shaped source/drain ultrathin silicon-on-insulator field-effect transistors; source/drain-tie effects; Capacitance-voltage characteristics; Dielectric breakdown; Dielectric measurements; Electric breakdown; Electric variables; FETs; High-K gate dielectrics; Leakage current; Rapid thermal annealing; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
ISSN :
1946-1542
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2009.5232676
Filename :
5232676
Link To Document :
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