Title :
Electrothermal transport in carbon nanofiber interconnects
Author :
Yamada, Toshishige ; Saito, Tsutomu ; Fabris, Drazen ; Yang, Cary Y.
Author_Institution :
Center for Nanostruct., Santa Clara Univ., Santa Clara, CA, USA
Abstract :
Based on extensive experimental information, a model is developed that takes into account heat transport through the entire carbon nanofiber interconnect test structure and breakdown location. This electrothermal transport model elucidates observed current capacity behavior, and predicts variations in contact location with the support material. The resulting heat dissipation and current capacity are completely consistent with measurement data.
Keywords :
carbon fibres; heat conduction; integrated circuit interconnections; nanofibres; thermal conductivity; transport processes; carbon nanofiber interconnects; contact location; current capacity behavior; electrothermal transport; heat dissipation; heat transport; Current measurement; Density measurement; Electric breakdown; Electrodes; Electrothermal effects; Gold; Image segmentation; Length measurement; Nanostructures; Scanning electron microscopy;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232679
