DocumentCode
3295540
Title
Computation of Temperature Distribution into Test Structure of Microsystem Heat Flux Sensor
Author
Fomenko, Svetlana V. ; Dikareva, Regina P. ; Lobach, Oleg V.
Author_Institution
Novosibirsk State Tech. Univ., Novosibirsk
fYear
2007
fDate
June 1 2007-July 5 2007
Firstpage
115
Lastpage
117
Abstract
In the article the test structure of the microsystem heat flux sensor is presented. Computation methods of temperature distribution which allow counting output parameters and a sensitivity of the heat flux sensor are considered. Results of a numerical modeling and their comparison with an analytical computation of a temperature distribution in the sensor are given.
Keywords
finite element analysis; heat transfer; temperature sensors; counting output parameters; finite element analysis; microsystem heat flux sensor; numerical modeling; temperature distribution computation; test structure; Distributed computing; Finite element methods; Heating; Resistors; Temperature distribution; Temperature sensors; Testing; Thermal conductivity; Thermal sensors; Voltage; a heat flux sensor; finite-element analysis; temperature distribution modeling; thermo-EMF;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials, 2007. EDM '07. 8th Siberian Russian Workshop and Tutorial on
Conference_Location
Erlagol, Altai
ISSN
1815-3712
Print_ISBN
978-5-7782-0752-3
Type
conf
DOI
10.1109/SIBEDM.2007.4292929
Filename
4292929
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