DocumentCode :
3295584
Title :
Failure analysis overview and its new challenges
Author :
Li, Susan X.
Author_Institution :
Spansion Inc., Sunnyvale, CA, USA
fYear :
2009
fDate :
6-10 July 2009
Firstpage :
100
Lastpage :
107
Abstract :
Failure analysis is a critical step for solving design, process, product and customer application issues. Failure analysts need to have strong and broad technical background as well as unique personality to be successful in this field. Failure analysis flow contains 8 basic steps, and should be followed to ensure the quality of the daily analysis work. Three case studies were demonstrated on how to use the 8-step FA flow to solve real life problems. With new technology, device materials and architecture in advanced products, new challenges need to be met in order to successfully support the failure analysis needs in the coming years.
Keywords :
failure analysis; integrated circuit reliability; 8-step FA flow; failure analysis; semiconductor company; Failure analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
ISSN :
1946-1542
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2009.5232690
Filename :
5232690
Link To Document :
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