The effect of polyimide surface treatment on flip-chip assembly

Author

Ong, M.C. ; Zhao, X.L. ; Lim, S.H. ; Chin, J.M. ; Leong, Chia-Ken ; Lim, Kevin ; Kuechenmeister, Frank ; Jungnickel, Gotthard ; Platz, Alexander ; Su, Michael ; Syahirah, Z. ; Dong, Z.L.

Author_Institution

Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore

fYear

2009

fDate

6-10 July 2009

Firstpage

87

Lastpage

90

Abstract

This paper studied the effects of polyimide surface morphology and RIE treatment for lead-free C4 bumping of SOI device on assembly process by flip-chip technique. The characterizations were experimentally carried out with FTIR, AFM and CSAM. The process sequences have been optimized based on the DOE results.

Keywords

atomic force microscopy; design of experiments; flip-chip devices; silicon-on-insulator; DOE; SOI device; assembly process; flip-chip assembly; polyimide surface morphology; polyimide surface treatment; Adhesives; Assembly; Atomic force microscopy; Environmentally friendly manufacturing techniques; Packaging; Polyimides; Silicon; Surface morphology; Surface treatment; US Department of Energy;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the

Conference_Location

Suzhou, Jiangsu

ISSN

1946-1542

Print_ISBN

978-1-4244-3911-9

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2009.5232691

Filename

5232691