Title :
Physical failure analysis of package qualification for new product and process
Author :
Lin, Yi-Chen ; Chang, Hung-Jia
Author_Institution :
Quality Div., Powerchip Semicond. Corp., Hsinchu, Taiwan
Abstract :
In the studies, we investigate the cause of failure that occur during pilot run and new process evaluation. The results are fed back to wafer and assembly design and process improvement. From our results, the evaluation for package qualification can find out not only package but also wafer process issue.
Keywords :
DRAM chips; ball grid arrays; failure analysis; DRAM product; assembly design; dynamic random access memory; package qualification evaluation; physical failure analysis; wafer process evaluation; window ball grid array; Aluminum; Assembly; Corrosion; Failure analysis; Humidity; Qualifications; Semiconductor device packaging; Stress; Testing; Wire;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5596-6
DOI :
10.1109/IPFA.2010.5531977
