Title :
Chip-level and board-level CDM ESD tests on IC products
Author :
Ker, Ming-Dou ; Huang, Chih-Kuo ; Hsiao, Yuan-Wen ; Hsieh, Yong-Fen
Author_Institution :
Inst. of Electron., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
Abstract :
The electrostatic discharge (ESD) transient currents and failure analysis (FA) between chip-level and board-level charged-device-model (CDM) ESD tests are investigated in this work. The discharging current waveforms of three different printed circuit boards (PCBs) are characterized first. Then, the chip-level and board-level CDM ESD tests are performed to an ESD-protected dummy NMOS and a high-speed receiver front-end circuit, respectively. Scanning electron microscope (SEM) failure pictures show that the board-level CDM ESD test causes much severer failure than that caused by the chip-level CDM ESD test.
Keywords :
electrostatic discharge; failure analysis; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; printed circuit manufacture; scanning electron microscopy; IC products; PCB; board-level CDM ESD; charged-device-model; chip-level ESD test; electrostatic discharge; failure analysis; high-speed receiver front-end circuit; printed circuit boards; scanning electron microscope; transient currents; Application specific integrated circuits; Capacitance; Circuit testing; Electronic equipment testing; Electrostatic discharge; Integrated circuit testing; Performance evaluation; Printed circuits; Semiconductor device measurement; System testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232702
