• DocumentCode
    3295865
  • Title

    Resolution and sensitivity enhancements of scanning optical microscopy techniques for integrated circuit failure analysis

  • Author

    Phang, Jacob H. ; Goh, S.H. ; Quah, A.C.T. ; Chua, C.M. ; Koh, L.S. ; Tan, S.H. ; Chua, W.P.

  • Author_Institution
    Centre for Integrated Circuit Failure Anal. & Reliability (CICFAR), Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    11
  • Lastpage
    18
  • Abstract
    Scanning optical microscopy techniques are effective for optical fault localization of failures that are sensitive to thermal stimulation. In this paper, the recent developments in resolution and sensitivity enhancements that allow these techniques to be used with advanced technology nodes are described. The enhancement methods include refractive solid immersion lens technology, dc-coupling of the laser induced detection system and laser pulsing with signal integration algorithm. The combination of these enhanced scanning optical microscopy techniques and refractive solid immersion lens technology has brought about significantly better localization precision and sensitivity.
  • Keywords
    failure analysis; monolithic integrated circuits; optical microscopy; sensitivity; dc-coupling; integrated circuit failure analysis; laser induced detection system; laser pulsing; lens technology; optical fault localization; refractive solid immersion; refractive solid immersion lens technology; scanning optical microscopy techniques; sensitivity enhancements; signal integration algorithm; thermal stimulation; Circuit faults; Failure analysis; Integrated optics; Lenses; Optical microscopy; Optical refraction; Optical sensors; Photonic integrated circuits; Solid lasers; Stimulated emission;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232707
  • Filename
    5232707