DocumentCode
3295865
Title
Resolution and sensitivity enhancements of scanning optical microscopy techniques for integrated circuit failure analysis
Author
Phang, Jacob H. ; Goh, S.H. ; Quah, A.C.T. ; Chua, C.M. ; Koh, L.S. ; Tan, S.H. ; Chua, W.P.
Author_Institution
Centre for Integrated Circuit Failure Anal. & Reliability (CICFAR), Nat. Univ. of Singapore, Singapore, Singapore
fYear
2009
fDate
6-10 July 2009
Firstpage
11
Lastpage
18
Abstract
Scanning optical microscopy techniques are effective for optical fault localization of failures that are sensitive to thermal stimulation. In this paper, the recent developments in resolution and sensitivity enhancements that allow these techniques to be used with advanced technology nodes are described. The enhancement methods include refractive solid immersion lens technology, dc-coupling of the laser induced detection system and laser pulsing with signal integration algorithm. The combination of these enhanced scanning optical microscopy techniques and refractive solid immersion lens technology has brought about significantly better localization precision and sensitivity.
Keywords
failure analysis; monolithic integrated circuits; optical microscopy; sensitivity; dc-coupling; integrated circuit failure analysis; laser induced detection system; laser pulsing; lens technology; optical fault localization; refractive solid immersion; refractive solid immersion lens technology; scanning optical microscopy techniques; sensitivity enhancements; signal integration algorithm; thermal stimulation; Circuit faults; Failure analysis; Integrated optics; Lenses; Optical microscopy; Optical refraction; Optical sensors; Photonic integrated circuits; Solid lasers; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232707
Filename
5232707
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