Title :
In-situ polyimide removal using modified dual acid decapsulator
Author :
Ramachandra, C. ; Dash, Sarat Kumar ; Ravindra, M. ; Khan, Adnan M. ; Sweety, B.M. ; Chandan, U.G. ; Jaypal, D.
Author_Institution :
Siddaganga Inst. of Technol., Tumkur, India
Abstract :
Removal of polyimide layer after decapsulation of IC package is essential for many of the failure analysis techniques. An alternative method for polyimide removal is described in this paper. The method suggests appropriate modification of dual acid decapsulation system for this purpose. Device integrity is verified after removal of polyimide layer. This method becomes promising for devices which are sensitive/vulnerable for exposure to plasma.
Keywords :
failure analysis; integrated circuit packaging; IC package decapsulation; device integrity; failure analysis techniques; in-situ polyimide removal; modified dual acid decapsulator; Chemicals; Failure analysis; Integrated circuit packaging; Passivation; Plasma applications; Plasma devices; Plasma temperature; Plastic integrated circuit packaging; Polyimides; Valves;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5596-6
DOI :
10.1109/IPFA.2010.5531986
