• DocumentCode
    3295995
  • Title

    Failure analysis in the integrated fabless manufacturer (IFM) environment

  • Author

    Street, A.G.

  • Author_Institution
    Qualcomm CDMA Technol. Asia Pacific, Singapore, Singapore
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    824
  • Lastpage
    826
  • Abstract
    Failure analysis tools and techniques have been evolving since engineers first took electronic components apart to see why they failed. First, using existing tools like optical microscopes, electrical test bench instruments and the machine shop to electrically and physically peer inside failed parts, failure analysts developed new methods, and later new tools to look inside electronic components and see physical structures and electrical signals. At the same time, the role failure analysis plays in the design and development cycle of systems and has expanded well beyond the original focus of quality and reliability.
  • Keywords
    customer satisfaction; failure analysis; integrated circuit design; integrated circuit manufacture; product design; product life cycle management; electrical signal; electrical test bench instruments; electronic components; failure analysis; integrated fabless manufacturer environment; machine shop; optical microscopes; Electron microscopy; Electronic components; Electronic equipment testing; Failure analysis; Instruments; Machine shops; Manufacturing; Optical devices; Optical microscopy; Signal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232713
  • Filename
    5232713