DocumentCode
3295995
Title
Failure analysis in the integrated fabless manufacturer (IFM) environment
Author
Street, A.G.
Author_Institution
Qualcomm CDMA Technol. Asia Pacific, Singapore, Singapore
fYear
2009
fDate
6-10 July 2009
Firstpage
824
Lastpage
826
Abstract
Failure analysis tools and techniques have been evolving since engineers first took electronic components apart to see why they failed. First, using existing tools like optical microscopes, electrical test bench instruments and the machine shop to electrically and physically peer inside failed parts, failure analysts developed new methods, and later new tools to look inside electronic components and see physical structures and electrical signals. At the same time, the role failure analysis plays in the design and development cycle of systems and has expanded well beyond the original focus of quality and reliability.
Keywords
customer satisfaction; failure analysis; integrated circuit design; integrated circuit manufacture; product design; product life cycle management; electrical signal; electrical test bench instruments; electronic components; failure analysis; integrated fabless manufacturer environment; machine shop; optical microscopes; Electron microscopy; Electronic components; Electronic equipment testing; Failure analysis; Instruments; Machine shops; Manufacturing; Optical devices; Optical microscopy; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232713
Filename
5232713
Link To Document