Title :
Failure analysis in the integrated fabless manufacturer (IFM) environment
Author_Institution :
Qualcomm CDMA Technol. Asia Pacific, Singapore, Singapore
Abstract :
Failure analysis tools and techniques have been evolving since engineers first took electronic components apart to see why they failed. First, using existing tools like optical microscopes, electrical test bench instruments and the machine shop to electrically and physically peer inside failed parts, failure analysts developed new methods, and later new tools to look inside electronic components and see physical structures and electrical signals. At the same time, the role failure analysis plays in the design and development cycle of systems and has expanded well beyond the original focus of quality and reliability.
Keywords :
customer satisfaction; failure analysis; integrated circuit design; integrated circuit manufacture; product design; product life cycle management; electrical signal; electrical test bench instruments; electronic components; failure analysis; integrated fabless manufacturer environment; machine shop; optical microscopes; Electron microscopy; Electronic components; Electronic equipment testing; Failure analysis; Instruments; Machine shops; Manufacturing; Optical devices; Optical microscopy; Signal analysis;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232713
