DocumentCode :
3296165
Title :
A new soft-error phenomenon in VLSIs: the alpha-particle-induced source/drain penetration (ALPEN) effect
Author :
Takeda, Eiji ; Hisamoto, D. ; Toyabe, Tohru
Author_Institution :
Hitachi Ltd., Tokyo, Japan
fYear :
1988
fDate :
12-14 Apr 1988
Firstpage :
109
Lastpage :
112
Abstract :
The alpha-particle source/drain penetration (ALPEN) effect is investigated using a 3-D device simulator (CADDETH) and a novel experimental method. A study of soft error due to alpha-particle injection has so far focused on such memory structures and circuits as DRAMs/SRAMs. However, a new soft error is expected to occur in single MOSFETs as the effective channel length becomes comparable to the funneling length. The authors describe: (1) the funneling penetration current between source and drain; (2) a new soft error (0→1) caused by the ALPEN effect; (3) experimental verification of the ALPEN effect; and (4) the impact on VLSI scaling. The ALPEN effect puts various constraints, such as the latch-up, emitter-to-collector short in bipolars, and punchthrough in parasitic MOSFETs, on VLSI design. Thus, the ALPEN effect will be a crucial factor in the scaling limits of future ULSIs with dimensions below 0.5 μm
Keywords :
VLSI; alpha-particle effects; circuit reliability; insulated gate field effect transistors; integrated circuit technology; integrated circuit testing; 3D device simulator; ALPEN effect; CADDETH; MOSFETs; ULSIs; VLSI scaling; alpha-particle-induced source/drain penetration; effective channel length; emitter-to-collector short; funneling length; funneling penetration current; latch-up; punchthrough; soft-error phenomenon; Circuit simulation; Electrodes; Electrons; Geometry; Laboratories; MOSFETs; Power supplies; Random access memory; Read-write memory; Ultra large scale integration; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium 1988. 26th Annual Proceedings., International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/RELPHY.1988.23436
Filename :
23436
Link To Document :
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