DocumentCode :
3296166
Title :
Acting capability of flux for Pb-free interconnection in electronics assembly
Author :
Du, Changhua ; Zha, Jing ; Du, Yunfei ; Chen, Fang ; Zha, Haijian
Author_Institution :
Sch. of Mater., Chongqing Univ. of Technol., Chongqing, China
fYear :
2009
fDate :
6-10 July 2009
Firstpage :
790
Lastpage :
793
Abstract :
The components and characteristics of flux used for Pb-free interconnection are discussed. Applying physical chemistry principles, the decisive factors, activation capability and limit of the flux´s activity are analyzed. The results show that special flux must be used in Pb-free interconnections, and acting capability of flux mainly depends on the selected activator, and the built-up activator is an effective way to elevate activity. Flux with high activity can significantly enhance sigmas-f and reduce sigmal-f, but it can not reduce sigmas-l effectively. It is a basic reason why activity is difficult to exert. Reducing the fast growth of inter-metallic compound (IMC) at the interface is a vital measure to improve acting capability of flux.
Keywords :
assembling; electronic engineering; electronics industry; environmental factors; built-up activator; electronics assembly; flux activity; intermetallic compound; lead-free interconnection; physical chemistry principles; Assembly; Chemical technology; Chemistry; Corrosion inhibitors; Insulation; Intermetallic; Lead; Pollution measurement; Soldering; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
ISSN :
1946-1542
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2009.5232721
Filename :
5232721
Link To Document :
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