Water-soluble fluxes for Sn-4Zn-0.89Cu-3.5Bi-0.3Re alloy lead-free solder

Author

Yang, Min ; Zhang, Tao ; Liu, Xiuzhong ; He, Songming

Author_Institution

Key Lab. of Liquid Struct. & Heredity of Mater., Shandong Univ., Jinan, China

fYear

2009

fDate

6-10 July 2009

Firstpage

785

Lastpage

789

Abstract

Spreading areas were measured to characterize the influence of various water-soluble fluxes on Sn₄Zn_0.89Cu_3.5Bi_0.3Re alloy solder wettability. The fluxes were composed of glutamic acid, dense hydrochloric acid, water, zinc chloride, ammonium chloride, turpentine, glycerin, ethanol, cupric chloride, acetone, citric acid, methanoic acid, carbmide and water. The microstructure and elemental distribution at the interface between the solder alloy and the Cu substrate were analyzed by EPMA. Results show that the wettability of Sn₄Zn_0.89Cu_3.5Bi_0.3Re solder alloy to copper can be greatly influenced by flux composition. A flux consisting of glutamic acid, dense hydrochloric acid and water has the best overall properties.

Keywords

copper alloys; solders; tin alloys; zinc alloys; EPMA; Sn₄Zn_0.89Cu_3.5Bi_0.3Re; acetone; alloy lead-free solder; alloy solder wettability; ammonium chloride; carbmide; citric acid; cupric chloride; elemental distribution; ethanol; flux composition; glutamic acid; glycerin; hydrochloric acid; methanoic acid; microstructure; turpentine; water-soluble fluxes; zinc chloride; Amino acids; Area measurement; Bismuth; Copper alloys; Environmentally friendly manufacturing techniques; Ethanol; Lead; Microstructure; Tin; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the

Conference_Location

Suzhou, Jiangsu

ISSN

1946-1542

Print_ISBN

978-1-4244-3911-9

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2009.5232724

Filename

5232724