Title :
Water-soluble fluxes for Sn-4Zn-0.89Cu-3.5Bi-0.3Re alloy lead-free solder
Author :
Yang, Min ; Zhang, Tao ; Liu, Xiuzhong ; He, Songming
Author_Institution :
Key Lab. of Liquid Struct. & Heredity of Mater., Shandong Univ., Jinan, China
Abstract :
Spreading areas were measured to characterize the influence of various water-soluble fluxes on Sn4Zn0.89Cu3.5Bi0.3Re alloy solder wettability. The fluxes were composed of glutamic acid, dense hydrochloric acid, water, zinc chloride, ammonium chloride, turpentine, glycerin, ethanol, cupric chloride, acetone, citric acid, methanoic acid, carbmide and water. The microstructure and elemental distribution at the interface between the solder alloy and the Cu substrate were analyzed by EPMA. Results show that the wettability of Sn4Zn0.89Cu3.5Bi0.3Re solder alloy to copper can be greatly influenced by flux composition. A flux consisting of glutamic acid, dense hydrochloric acid and water has the best overall properties.
Keywords :
copper alloys; solders; tin alloys; zinc alloys; EPMA; Sn4Zn0.89Cu3.5Bi0.3Re; acetone; alloy lead-free solder; alloy solder wettability; ammonium chloride; carbmide; citric acid; cupric chloride; elemental distribution; ethanol; flux composition; glutamic acid; glycerin; hydrochloric acid; methanoic acid; microstructure; turpentine; water-soluble fluxes; zinc chloride; Amino acids; Area measurement; Bismuth; Copper alloys; Environmentally friendly manufacturing techniques; Ethanol; Lead; Microstructure; Tin; Zinc;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232724
