DocumentCode :
3296218
Title :
A test methodology to monitor and predict early life reliability failure mechanisms
Author :
Conrad, T.R. ; Mielnik, R.J. ; Musolino, L.S.
Author_Institution :
AT&T Microelectron., Allentown, PA, USA
fYear :
1988
fDate :
12-14 Apr 1988
Firstpage :
126
Lastpage :
130
Abstract :
A description is given of a test methodology called operational life testing (OLT), which has been implemented to monitor and quantify the early-life reliability of selected semiconductor technologies and identify early-life failure mechanisms. This monitor measures the effectiveness of screens and tests used to remove device infant-mortality failure modes. In addition, the early-life reliability monitor complements the data derived from highly accelerated long-term reliability tests since it highlights specific failure modes which are not predominant in highly accelerated long-term reliability tests. Information gained from the monitor can be used to implement tests and screens designed to eliminate certain failure modes in a more timely manner than accumulating and analyzing field return data
Keywords :
circuit reliability; failure analysis; integrated circuit testing; life testing; monitoring; IC testing; device infant-mortality failure modes; early life reliability failure mechanisms; monitoring; operational life testing; screens; semiconductor technologies; test methodology; Condition monitoring; Costs; Data analysis; Electronic components; Failure analysis; Information analysis; Life estimation; Life testing; Microelectronics; Semiconductor device reliability; Semiconductor device testing; System testing; Temperature; Weibull distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium 1988. 26th Annual Proceedings., International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/RELPHY.1988.23439
Filename :
23439
Link To Document :
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