DocumentCode
3296400
Title
Statistics for electromigration testing
Author
Schafft, Harry ; Lechner, James A. ; Sabi, Babak ; Mahaney, Mike ; Smith, Ron C.
Author_Institution
NBS, Gaithersburg, MD, USA
fYear
1988
fDate
12-14 Apr 1988
Firstpage
192
Lastpage
202
Abstract
A comprehensive statistical basis is given for the design and conduction of electromigration stress tests that allows for the efficient use of test parts, equipment, and test time. It shows how to select the size of the sample, the required control of the stress conditions, and the number of failures required before halting the test in order to characterize metallization interconnects with a quantifiable level of confidence. The results are applicable to any failure mechanism for which the failure times obey a normal or log-normal distribution
Keywords
electromigration; failure analysis; metallisation; statistical analysis; electromigration stress tests; failure mechanism; failure times; metallization interconnects; quantifiable level of confidence; statistical basis; stress condition control; Electromigration; Failure analysis; Log-normal distribution; Metallization; NIST; Sampling methods; Size control; Statistical analysis; Stress control; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium 1988. 26th Annual Proceedings., International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/RELPHY.1988.23449
Filename
23449
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