• DocumentCode
    3296553
  • Title

    Structuring Nonstoichiometric Conductive Fillers in Polymeric Matrices

  • Author

    Ishkov, A.V.

  • Author_Institution
    Altai State Univ., Barnaul
  • fYear
    2005
  • fDate
    21-27 March 2005
  • Firstpage
    127
  • Lastpage
    127
  • Abstract
    The titanium carbides, nitrides and carbonitrides of different composition are proposed as promising conductive fillers for manufacturing electroconductive polymeric composite material (EPCM) for radioelectronic technique able to replace powders of precious metals. When obtaining EPCM based on nonstoichiometric conductive titanium compound and investigating their properties, the effect of structuring denoting conductive fillers in composites outside the limit of leakage is revealed. Such structuring the filler is distinctive feature of investigated materials and is an additional factor determining electric properties of composite. The fractal dimension of filler limits has been determined by special computer program. Thus, described structuring fillers in polymeric matrices cause additional growth of electric conductance in high-filled composites.
  • Keywords
    electrical conductivity; filled polymers; fractals; materials preparation; stoichiometry; titanium compounds; carbonitrides; computer program; electric conductance; electroconductive polymeric composite material; fractal dimension; nonstoichiometric conductive fillers; polymeric matrices; radioelectronic technique; structuring effect; titanium carbides; Chemistry; Composite materials; Conducting materials; Fractals; Manufacturing; Materials science and technology; Physics; Polymers; Powders; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Modern Technique and Technologies, 2005. MTT 2005. 11th International Scientific and Practical Conference of Students, Post-graduates and Young Scientists
  • Conference_Location
    Tomsk
  • Print_ISBN
    978-0-7803-8877-2
  • Electronic_ISBN
    978-0-7803-8878-9
  • Type

    conf

  • DOI
    10.1109/SPCMTT.2005.4493220
  • Filename
    4493220