DocumentCode
3296576
Title
When IC yield missed the target, who is at fault?
Author
Lanza, L. ; Strojwas, A. ; Campbell, M. ; Gerousis, V.C. ; Hogan, J. ; Kibarian, J. ; Levitt, M. ; Ng, W. ; Pramanik, D. ; Templeton, M.
Author_Institution
Lanza techVentures, Palo Alto, CA
fYear
2004
fDate
7-11 July 2004
Firstpage
80
Lastpage
80
Abstract
Silicon yield once was dominated by contaminants and particulates, making yield a process issue. But with today´s electronics supply chain, multiple suspects may be indicted on manufacturability issues. Who is responsible for preventative actions in manufacturability and yield? The panelists, representing a foundry, a fabless company, an IP provider, two EDA vendors, and an IC design team, will discuss the problems and the solutions for achieving manufacturability and yield goals.
Keywords
Electronic design automation and methodology; Foundries; Manufacturing; Semiconductor device manufacture; Silicon; Supply chains;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2004. Proceedings. 41st
Conference_Location
San Diego, CA, USA
ISSN
0738-100X
Print_ISBN
1-51183-828-8
Type
conf
Filename
1322446
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