• DocumentCode
    3296762
  • Title

    Expanding functional capabilities of thermionic vacuum integrated microcircuits as exemplified by an a.c. amplifier

  • Author

    Grigorishin, I.L. ; Mukhurov, N.I. ; Kotova, I.F.

  • Author_Institution
    Inst of Electron., Belarus Acad. of Sci., Minsk, Russia
  • fYear
    1996
  • fDate
    7-12 Jul 1996
  • Firstpage
    589
  • Lastpage
    592
  • Abstract
    This paper deals with circuit design aspects of making the a.c. amplifier based on the potentials and specific features of the process of anodic oxidation of aluminium to form dielectric substrates of cathode-heating assemblies (CHA) and anode-grid assemblies (AGA). Design and technological methods are described that are used to make active (five vacuum microtriodes) and passive (resistors, capacitors, commutation) elements. As compared to earlier devices, the a.c. amplifier vacuum integrated microcircuits (VIMC) are more economical and have better characteristics in terms of miniaturization and integration. Its fundamental peculiarities are the use of two-sided through-anodizing to form dielectric substrates with microrelief and superfine-structure grids of microtriodes. Some characteristics of the a.c. amplifier VIMC are given and ways of improving them are discussed
  • Keywords
    thermionic electron emission; triodes; vacuum microelectronics; wideband amplifiers; AC amplifier; anode-grid assemblies; anodic oxidation; cathode-heating assemblies; circuit design aspects; dielectric substrates; functional capabilities; superfine-structure grids; thermionic vacuum integrated microcircuits; two-sided through-anodizing; vacuum microtriodes; Aluminum; Assembly; Capacitors; Circuit synthesis; Design methodology; Dielectric substrates; Integrated circuit technology; Oxidation; Resistors; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Microelectronics Conference, 1996. IVMC'96., 9th International
  • Conference_Location
    St. Petersburg
  • Print_ISBN
    0-7803-3594-5
  • Type

    conf

  • DOI
    10.1109/IVMC.1996.601892
  • Filename
    601892