Title :
Practical Considerations in the Modeling and Characterization of Printed-Circuit Board Wiring
Author :
Deutsch, A. ; Krabbenhoft, R.S. ; Surovic, C.W. ; Winkel, T.-M. ; Schuster, C. ; Kwark, Y.H. ; Klink, E.
Author_Institution :
IBM Syst. & Technol. Group, Rochester, MN
Abstract :
The importance of increased accuracy in modeling and characterization of printed-circuit board wiring is highlighted through practical examples. Recommendations are given regarding model causality, bandwidth, measurement methodology improvement for both production-level and off-line monitoring of impedance, roughness, and dielectric loss and their significance for system design, performance, delivery, and cost is discussed
Keywords :
monitoring; printed circuit design; wiring; dielectric loss; model causality; off-line monitoring; printed-circuit board wiring; Bandwidth; Costs; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Impedance measurement; Loss measurement; Monitoring; Performance loss; Wiring;
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin, Germany
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
DOI :
10.1109/SPI.2006.289144
