A Multiple Domain Characterisation and Test Method for Discontinous Signal Paths

A non-invasive method is presented that allows to both characterise and test relevant properties of discontinous signal paths in frequency and time domain with very high accuracy. Such signal paths include e.g. PCB traces, PCB/backplane/PCB interconnects and cable/connector assemblies. Measurement is done in frequency domain and various frequency and time domain representations (e.g. eye diagrams) are derived. The method overcomes the obstacle of multiple reflections and displays true system structure (e.g. impedance profile) instead of just system responses. Furthermore, lossy transmission line parameters as well as lumped parasitics are extracted