• DocumentCode
    3297362
  • Title

    A breast molecular imaging hybrid pixel sensor test chip with low noise CMOS readout IC on fully depleted silicon-on-insulator design

  • Author

    Nguyen, D. ; Cormican, H. ; Baysal, A. ; Wiswall, C. ; Kerr, T. ; Wang, J.M. ; Ma, D.

  • Author_Institution
    Bioptics Inc., Tucson, AZ
  • fYear
    2009
  • fDate
    9-11 April 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper reports the design of an innovative CMOS active pixel sensor (CAPS) using Silicon-on-Insulator (SOI) technology. The CAPS designs approach provides the flexibility and high density features of hybrid pixel sensors with photon integration architecture. This sensor is the key component for the optimized biomarker scanner. A proof-of-principle test chip, paying particular attention to the noise performance of the pixel, the conversion gain, front-end electronics (FEE) and readout speed, can be available for testing in 2009. The overall objective of this paper is to contribute to improved diagnosis, prognosis, and prediction of breast cancer disease through the development of a very high conversion gain, low noise Photon Integration CMOS Imager. The design target for fluorescent detection limit with the CAPS is 4.49 fluorophores / mum2.
  • Keywords
    CMOS integrated circuits; biomedical optical imaging; cancer; patient diagnosis; readout electronics; silicon-on-insulator; CMOS active pixel sensor; breast cancer disease prediction; breast molecular imaging; conversion gain; front-end electronics; fully depleted silicon-on-insulator design; hybrid pixel sensor test chip; low noise CMOS readout IC; optimized biomarker scanner; patient diagnosis; photon integration architecture; prognosis; proof-of-principle test chip; readout speed; silicon-on-insulator technology; Breast; CMOS image sensors; CMOS integrated circuits; Electronic equipment testing; Hybrid integrated circuits; Integrated circuit noise; Integrated circuit testing; Molecular imaging; Pixel; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Complex Medical Engineering, 2009. CME. ICME International Conference on
  • Conference_Location
    Tempe, AZ
  • Print_ISBN
    978-1-4244-3315-5
  • Electronic_ISBN
    978-1-4244-3316-2
  • Type

    conf

  • DOI
    10.1109/ICCME.2009.4906588
  • Filename
    4906588