DocumentCode
3297435
Title
Energy-Aware and Application Dependent Optimization of On-Chip Micro-strip Transmission Lines
Author
Bamal, M. ; Stucchi, Michele ; Maex, K.
Author_Institution
IMEC, Leuven
fYear
2006
fDate
9-12 May 2006
Firstpage
239
Lastpage
242
Abstract
On-chip transmission lines or wafer-level package (WLP) lines can provide near speed of light signal propagation and are an attractive interconnect option for high-speed and low-power communication. In this paper we propose an application dependent optimization strategy to an appropriate selection of interconnect option from a set of interconnect technology options. The strategy is applied to a set of micro-strip lines and the most appropriate option for a high-speed application and a low-power application is selected
Keywords
integrated circuit interconnections; microstrip lines; microwave integrated circuits; wafer level packaging; application dependent optimization; high-speed communication; light signal propagation; low-power communication; on-chip microstrip transmission lines; wafer-level package lines; Bandwidth; CMOS technology; Delay; Integrated circuit interconnections; Optical propagation; Packaging; Power dissipation; Power system interconnection; Power transmission lines; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location
Berlin, Germany
Print_ISBN
1-4244-0455-x
Electronic_ISBN
1-4244-0455-x
Type
conf
DOI
10.1109/SPI.2006.289232
Filename
4069467
Link To Document