DocumentCode
3297497
Title
Victim and aggressor line electrical modelisation in an multicoupled interconnect environment for transient simulation
Author
Ponchel, F. ; Legier, Jf ; Paleczny, E. ; Seguinot, C. ; Deschacht, D.
Author_Institution
IEMN, Villeneuve d´´Ascq
fYear
2006
fDate
9-12 May 2006
Firstpage
249
Lastpage
251
Abstract
An electrical modelisation of eight lossy Cu interconnects is proposed thanks to the implementation of a vector finite element method. This full wave analysis gives frequency dependence of proper or mutual inductance, capacitance or resistance from resulting transmission line equations system. Spice results are then proposed for different set of spacing and low dielectric material in case of interconnects whose area is less than 1 m2 embedded in SiO2 interlevel or other low dielectric material
Keywords
dielectric materials; finite element analysis; interconnections; metallisation; transmission line theory; aggressor line electrical modelisation; dielectric material; full wave analysis; multicoupled interconnect environment; mutual inductance; transient simulation; transmission line equations system; vector finite element method; Clocks; Conductivity; Dielectric losses; Dielectric materials; Finite element methods; Frequency; Mathematical model; Metallization; Power system transients; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location
Berlin, Germany
Print_ISBN
1-4244-0455-x
Electronic_ISBN
1-4244-0455-x
Type
conf
DOI
10.1109/SPI.2006.289235
Filename
4069470
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