• DocumentCode
    3297497
  • Title

    Victim and aggressor line electrical modelisation in an multicoupled interconnect environment for transient simulation

  • Author

    Ponchel, F. ; Legier, Jf ; Paleczny, E. ; Seguinot, C. ; Deschacht, D.

  • Author_Institution
    IEMN, Villeneuve d´´Ascq
  • fYear
    2006
  • fDate
    9-12 May 2006
  • Firstpage
    249
  • Lastpage
    251
  • Abstract
    An electrical modelisation of eight lossy Cu interconnects is proposed thanks to the implementation of a vector finite element method. This full wave analysis gives frequency dependence of proper or mutual inductance, capacitance or resistance from resulting transmission line equations system. Spice results are then proposed for different set of spacing and low dielectric material in case of interconnects whose area is less than 1 m2 embedded in SiO2 interlevel or other low dielectric material
  • Keywords
    dielectric materials; finite element analysis; interconnections; metallisation; transmission line theory; aggressor line electrical modelisation; dielectric material; full wave analysis; multicoupled interconnect environment; mutual inductance; transient simulation; transmission line equations system; vector finite element method; Clocks; Conductivity; Dielectric losses; Dielectric materials; Finite element methods; Frequency; Mathematical model; Metallization; Power system transients; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2006. IEEE Workshop on
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    1-4244-0455-x
  • Electronic_ISBN
    1-4244-0455-x
  • Type

    conf

  • DOI
    10.1109/SPI.2006.289235
  • Filename
    4069470