• DocumentCode
    3299776
  • Title

    Study of annealing condition of InSbN alloys fabricated by ion implantation

  • Author

    Chen, X.Z. ; Zhang, D.H. ; Wang, Y. ; Jin, Y.J. ; Li, J.H. ; Deng, F.X. ; Zhang, Sam

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. of Univ., Singapore, Singapore
  • fYear
    2010
  • fDate
    5-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    InSbN alloys are the new narrow bandgap semiconductors capable of broadband and long wavelength infrared photodetection. This paper reports the annealing conditions on the properties and quality of InSbN alloys, fabricated by multi-step ion implantation. The InSbN samples were annealed at different annealing methods, temperatures, and periods of time. They were characterized by various techniques, such as x-ray photoelectron spectroscopy and x-ray diffraction. It is found that the low-temperature-long-time annealing was better for defects elimination, while high-temperature-short-time annealing made more nitrogen activated. With the experimental data, detailed bonding of nitrogen in the alloys and their effects on the quality and properties can be achieved.
  • Keywords
    X-ray diffraction; X-ray photoelectron spectra; annealing; antimony alloys; bonds (chemical); indium alloys; ion implantation; narrow band gap semiconductors; InSbN; InSbN alloys; X-ray diffraction; X-ray photoelectron spectroscopy; annealing condition; broadband infrared photodetection; defect elimination; ion implantation; long wavelength infrared photodetection; narrow bandgap semiconductors; nitrogen bonding; Atomic layer deposition; Furnaces; Ion implantation; Nitrogen; Photonic band gap; Plasma temperature; Rapid thermal annealing; Substrates; X-ray diffraction; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-5596-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2010.5532225
  • Filename
    5532225