Title :
Mechanical characterization of copper based metallizations with different via-bottom geometries
Author :
Ciptokusumo, J. ; Weide-Zaage, Kirsten ; Aubel, Oliver
Author_Institution :
Lab. fur Informationstechnologie, Leibniz Univ. Hannover, Hannover, Germany
Abstract :
The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
Keywords :
copper; finite element analysis; metallisation; reliability; Cu; Cu interconnects; FE-simulation; copper based metallizations; mechanical characterization; mechanical stress; reliability; via-bottom geometry; Copper; Information geometry; Laboratories; Metallization; Production; Samarium; Solid modeling; Thermal stresses; Voice mail; Young´s modulus;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5596-6
DOI :
10.1109/IPFA.2010.5532227
