DocumentCode
3299835
Title
Carbon doped SiGe heterojunction bipolar transistors for high frequency applications
Author
Osten, H.J. ; Knoll, D. ; Heinemann, B. ; Rucker, H. ; Tillack, B.
Author_Institution
Inst. for Semicond. Phys., Frankfurt, Germany
fYear
1999
fDate
1999
Firstpage
109
Lastpage
116
Abstract
The incorporation of low concentrations of carbon (<1020 cm-3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the-art SiGe HBTs. C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals
Keywords
Ge-Si alloys; UHF bipolar transistors; UHF integrated circuits; bipolar MMIC; boron; carbon; heterojunction bipolar transistors; microwave bipolar transistors; point defects; semiconductor materials; B outdiffusion suppression; C doped SiGe HBT; HF performance enhancement; Si point defects; SiGe heterojunction bipolar technology; SiGe heterojunction bipolar transistors; SiGe:B; SiGe:C; SiGe:C HBTs; high B doping level; high frequency applications; process margins; static parameters; very thin SiGe base layer; Annealing; Boron; Degradation; Doping; Frequency; Germanium silicon alloys; Heterojunction bipolar transistors; Photonic band gap; Physics; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting, 1999. Proceedings of the 1999
Conference_Location
Minneapolis, MN
ISSN
1088-5714-0
Print_ISBN
0-7803-5712-4
Type
conf
DOI
10.1109/BIPOL.1999.803538
Filename
803538
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