• DocumentCode
    3300009
  • Title

    Failure analysis of die crack in lidless packages

  • Author

    Foo, F.J. ; Ong, M.C. ; Tay, M.Y.

  • Author_Institution
    Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
  • fYear
    2010
  • fDate
    5-9 July 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Form factor requires lidless IC packages and die crack is one potential failure for exposed silicon dies. FA techniques such as SEM, FIB, and LSM are used to characterize the cracks to identity where they occur. The results also revealed intrinsic flaws that reduce the fracture strength of the die, making the die susceptible to cracking.
  • Keywords
    cracks; failure analysis; integrated circuit packaging; FA techniques; FIB; SEM; die crack failure analysis; lidless IC packages; silicon dies; Assembly; Costs; Failure analysis; Flip chip; Integrated circuit packaging; Optical microscopy; Scanning electron microscopy; Silicon; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-5596-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2010.5532238
  • Filename
    5532238
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3300009