DocumentCode
3300204
Title
Balancing design strategies and end-of-life processing
Author
Huisman, Jaco ; Stevels, Ab
Author_Institution
Fac. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
fYear
2003
fDate
8-11 Dec. 2003
Firstpage
40
Lastpage
47
Abstract
The QWERTY/EE concept developed at the TU Delft is applied to balance design strategies with end-of-life treatment processes. Based on this concept, the following approach is used for four different redesign cases of consumer electronic products: 1. Assessing the impact of three general design strategies for improving end-of-life performance: reducing parts and materials that are environmentally burdening in end-of-life, reallocating materials or components and improving connections between various parts. 2. Redesign priorities are determined by QWERTY/EE analysis showing which materials and components to focus on in particular. 3. Determining the feasibility of redesign options based on the technical and economical consequences of changes in the current product design. 4. Evaluation of the actual redesign in order to check whether or not an environmental improvement is realized. The results of this approach show the value of the QWERTY/EE concept for design for end-of-life activities. The actual redesign results show that despite the very limited degree a designer has for improving end-of-life aspects from an environmental perspective, still significant improvements can be realized in certain cases and not only from an environmental perspective but also in costs.
Keywords
consumer electronics; design for environment; electronic products; product design; recycling; consumer electronic products; design strategies; end of life activities; end of life treatment processing; environmental burden; material reallocation; product design; quotes for environmentally weighted recyclability concept; redesign; Consumer electronics; Environmental factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location
Tokyo, Japan
Print_ISBN
0-7803-8590-x
Type
conf
DOI
10.1109/ECODIM.2003.1322635
Filename
1322635
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