Title :
Defect localization using photon emission microscopy analysis with the combination of OBIRCH analysis
Author :
Chunlei, Wu ; Zhai, Linda ; Wang, Winter ; Song, Grace ; Jinglong, Li ; Joe, Yu ; Motohiko, Masuda
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
Photon emission microscopy analysis with the combination of OBIRCH analysis are very effective for defect localization, which can decrease analysis cycle time and improve success rates remarkably. In this paper, some cases are presented to show how to locate defects quickly by photon emission microscopy analysis with the combination of OBIRCH analysis.
Keywords :
crystal defects; failure analysis; photoelectron microscopy; OBIRCH analysis; defect localization; photon emission microscopy; Bridges; Computer aided software engineering; Failure analysis; Iron; Leak detection; MOS devices; Microcontrollers; Optical microscopy; Photonic integrated circuits; Surface emitting lasers;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5596-6
DOI :
10.1109/IPFA.2010.5532247
