DocumentCode :
3300305
Title :
Surface shape memory substrates for active cell culture
Author :
Davis, K.A. ; Burke, K.A. ; Mather, P.T. ; Henderson, J.H.
Author_Institution :
Dept. of Biomed. & Chem. Eng., Syracuse Univ., Syracuse, NY, USA
fYear :
2011
fDate :
1-3 April 2011
Firstpage :
1
Lastpage :
2
Abstract :
Shape memory polymer (SMP) substrates compatible with cell culture are presented that undergo programmed changes in surface topography on command to direct cell behavior. SMPs are a class of active materials that can be programmed to transition from a stable temporary shape to a permanent shape by a triggering mechanism, such as heat. Here, an SMP surface topography was programmed to transition from parallel micron-scale grooves to a flat surface. C3H/10T1/2 cells were allowed to adhere and spread on the temporary topography at 30°C. Topographic transition was then triggered by transfer to 37°C. Changes in substrate topography were found to direct cell behavior, as assessed by analysis of cell alignment, while high cell viability was maintained. This first example of active cell culture substrates should have great potential in the design of unique approaches for advanced investigation of mechanotransduction and cell biomechanical function and softmatter physics.
Keywords :
biomedical materials; cellular biophysics; intelligent materials; polymers; shape memory effects; surface topography; C3H-10T1/2 cells; SMP substrates; SMP surface topography; active cell culture; active materials; cell behavior direction; cell biomechanical function; cell viability; flat surface; mechanotransduction; parallel micronscale grooves; permanent shape; programmed surface topography changes; shape memory polymer; soft matter physics; stable temporary shape; surface shape memory substrates; temperature 30 degC; temperature 37 degC; topographic transition; triggering mechanism; Arrays; Polymers; Shape; Substrates; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioengineering Conference (NEBEC), 2011 IEEE 37th Annual Northeast
Conference_Location :
Troy, NY
ISSN :
2160-7001
Print_ISBN :
978-1-61284-827-3
Type :
conf
DOI :
10.1109/NEBC.2011.5778692
Filename :
5778692
Link To Document :
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