DocumentCode :
3300549
Title :
Ohmic contacts to p-type doped ZnO
Author :
Chuah, L.S. ; Tneh, S.S. ; Hassan, Z. ; Saw, K.G. ; Yam, F.K.
Author_Institution :
Sch. of Distance Educ., Univ. Sains Malaysia, Minden, Malaysia
fYear :
2012
fDate :
5-7 Jan. 2012
Firstpage :
1
Lastpage :
2
Abstract :
The electrical property and thermal stability of Pt ohmic contacts were studied.The phosphorus p-doped ZnO films were grown on glass substrates by the thermal evaporation. After the ZnO:P film growth, a Pt (100 nm) contact metal layers were deposited sequentially by dc sputtering. The sample annealed at 600 °C showed the best I-V characteristics of all samples. It was found that the samples annealed at 400, 500, 600 °C were ohmic. For 400, 500, 600 °C samples, the current increased visible reached nano-Ampere grade. Contacts annealed at 500 °C showed the largest current conduction. AFM 3D analysis was conducted to examine the surface morphology of the ZnO:P thin films. The surface roughnesses of the ZnO:P thin films were 11.23, 12.53, 16.70 and 19.21 nm for 300, 400, 500, 600 °C, respectively.
Keywords :
II-VI semiconductors; annealing; atomic force microscopy; ohmic contacts; phosphorus; platinum; semiconductor-metal boundaries; sputter deposition; surface morphology; surface roughness; thermal stability; thin films; vacuum deposition; wide band gap semiconductors; zinc compounds; AFM 3D analysis; Ohmic contacts; Pt-ZnO:P; SiO2; annealing; current conduction; dc sputtering deposition; electrical property; glass substrates; size 100 nm; surface morphology; surface roughnesses; temperature 300 degC to 600 degC; thermal evaporation; thermal stability; thin films; Annealing; Ohmic contacts; Rough surfaces; Surface morphology; Surface roughness; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Enabling Science and Nanotechnology (ESciNano), 2012 International Conference on
Conference_Location :
Johor Bahru
Print_ISBN :
978-1-4577-0799-5
Type :
conf
DOI :
10.1109/ESciNano.2012.6149667
Filename :
6149667
Link To Document :
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