• DocumentCode
    3301
  • Title

    An On-Chip Network Fabric Supporting Coarse-Grained Processor Array

  • Author

    Phi-Hung Pham ; Phuong Mau ; Jungmoon Kim ; Chulwoo Kim

  • Author_Institution
    Sch. of Electr. Eng., Korea Univ., Seoul, South Korea
  • Volume
    21
  • Issue
    1
  • fYear
    2013
  • fDate
    Jan. 2013
  • Firstpage
    178
  • Lastpage
    182
  • Abstract
    Coarse grained arrays (CGAs) with run-time reconfigurability play an important role in accelerating reconfigurable computing applications. It is challenging to design on-chip communication networks (OCNs) for such CGAs with dynamic run-time reconfigurability whilst satisfying the tight budgets of power and area for an embedded system. This paper presents a silicon-proven design of a 64-PE circuit-switched OCN fabric with a dynamic path-setup scheme capable of supporting an embedded coarse-grained processor array. A proof-of-concept test chip fabricated in a 0.13 μm CMOS process occupies a silicon area of 23 mm2 and consumes a peak power of 200 mW @ 128 MHz and 1.2 Vcc, at room temperature. The OCN overhead consumes 9.4% of the area and 18% of the power of the total chip. Experimental results and analysis show that the proposed OCN fabric with its dynamic path-setup is suitable for use in an embedded CGA supporting fast run-time reconfigurability.
  • Keywords
    CMOS integrated circuits; embedded systems; network-on-chip; CMOS process; OCN overhead; circuit switched OCN fabric; dynamic path setup; dynamic runtime reconfigurability; embedded coarse grained processor array; embedded system; on-chip communication networks; on-chip network fabric; reconfigurable computing application; room temperature; silicon proven design; test chip; Arrays; Integrated circuit interconnections; Network topology; Probes; Real time systems; System-on-a-chip; Topology; Coarse grained array (CGA); network-on-chip (NoC); on-chip communication network; reconfigurable computing;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2011.2181546
  • Filename
    6142140