DocumentCode
3301935
Title
Knowledge-based approximate life cycle assessment system in the collaborative design environment
Author
Park, Ji-Hyung ; Seo, Kwang-Kyu
Author_Institution
CAD-CAM Res. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea
fYear
2003
fDate
8-11 Dec. 2003
Firstpage
499
Lastpage
503
Abstract
In a competitive and globalized business environment, the need for green products becomes stronger. To meet these trends, environmental assessment besides delivery, cost and quality of products should be considered as an important factor in the new product development phase. In this paper, a knowledge-based approximate life cycle assessment system (KALCAS) for the collaborative design environment is developed to assess environmental impacts in the context of product concept development. It aims at improving the environmental efficiency of the product using artificial neural networks consisting of high-level product attributes and LCA results. The overall framework of the collaborative environment including KALCAS is proposed. The architecture for the collaborative design environment is used in the CO/spl trade/ environment to allow users on a wide variety of platforms to access the product data and other related information. It enables us to tradeoff the evaluation results between the objectives of design alternatives including environmental impacts in the collaborative design environment.
Keywords
design for environment; groupware; knowledge based systems; neural nets; product development; artificial neural networks; collaborative design environment; competitive business environment; environmental assessment; environmental impacts; globalized business environment; high level product attributes; knowledge based approximate life cycle assessment system; product data; product development; Collaborative work; Knowledge based systems; Neural networks; Product development;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location
Tokyo, Japan
Print_ISBN
0-7803-8590-x
Type
conf
DOI
10.1109/ECODIM.2003.1322723
Filename
1322723
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