• DocumentCode
    3302168
  • Title

    Status, prospects and commercialization of SiC power devices

  • Author

    Stephani, D.

  • Author_Institution
    SiCED Electron. Dev. GmbH & Co. KG, Erlangen, Germany
  • fYear
    2001
  • fDate
    25-27 June 2001
  • Firstpage
    14
  • Abstract
    Summary form only given. We have developed SiC Schottky diodes for blocking voltages ranging from 300 V to 1700 V covering a range of nominal currents from 4 A up to more than 25 A. Schottky diodes for blocking 300 V with nominal current ratings of 6 A and 10 A respectively, and for blocking 600 V with nominal current rating of 4 A and 6 A respectively, have already been commercialized by the parent Company Infineon Technologies AG; Schottky diodes for blocking 1200 V will follow soon. For higher blocking voltages up to 3 kV merged diodes were also successfully developed. We have also performed R&D on n-channel enhancement SiC MOSFETs. However, despite the promising performance ( 1800 V, 46 m/spl Omega/cm/sup 2/ e.g.) SiC MOSFET´s are still far away from commercialization due to the lack of long term stability and an on-resistance sufficiently low enough to compete with their silicon enemies. As a rugged and very promising alternative to the SiC MOSFET we have developed vertical junction field effect transistors (VJFETs).
  • Keywords
    Schottky diodes; junction gate field effect transistors; power MOSFET; power field effect transistors; power semiconductor diodes; silicon compounds; wide band gap semiconductors; 1800 V; 300 to 1700 V; 4 to 25 A; Schottky diodes; SiC; SiC power devices; VJFETs; blocking voltages; long term stability; merged diodes; n-channel enhancement MOSFETs; on-resistance; vertical junction field effect transistors; Commercialization; FETs; International collaboration; MOSFET circuits; Research and development; Schottky diodes; Silicon carbide; Solid state circuits; Stability; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2001
  • Conference_Location
    Notre Dame, IN, USA
  • Print_ISBN
    0-7803-7014-7
  • Type

    conf

  • DOI
    10.1109/DRC.2001.937852
  • Filename
    937852