DocumentCode
3302765
Title
Modelling the solder and resource consumption in lead-free soldering
Author
Deubzer, Otmar ; Meysel, Frederik ; Muñoz, Jesus Reyes
Author_Institution
Technische Univ. Berlin, Germany
fYear
2003
fDate
8-11 Dec. 2003
Firstpage
714
Lastpage
720
Abstract
The electronics industry is shifting towards lead-free soldering. However, lead-free soldering arises concern because of the consumption of scarce resources like silver. Tin does not receive much attention, but compared to lead is scarce as well and the recycling rates are contentious. Sustainability considerations require careful use of resources, especially of scarcer and non-renewable ones. A dynamic model will help to assess the current status and future development of solder consumption and the resulting resource consumption. The current status of solder consumption and recycling shows the resource consumption for metals in (lead-free) solders. The use of silver and of additional tin in lead-free solders should not endanger the supply security. However, interlinkage of silver, lead and tin in ores, as well as the forecasted strong market growth of electronics may have strong influences. The forecasted increasing market of electronics devices requires miniaturization and integration as well as proper recycling to save scarce resources. A tool for sustainability evaluation will help to properly align alloy selection, recycling and legal regulations for most sustainable implementation of lead-free interconnection technologies.
Keywords
electronics industry; printed circuits; recycling; reflow soldering; silver alloys; solders; tin alloys; wave soldering; SnAg; electronics industry; forecasted market growth; lead free interconnection technology; lead free soldering; ores; recycling rates; resource consumption; silver; solder consumption; tin; Electronics industry; Environmental factors; Printed circuits; Silver alloys; Soldering; Tin alloys;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location
Tokyo, Japan
Print_ISBN
0-7803-8590-x
Type
conf
DOI
10.1109/ECODIM.2003.1322762
Filename
1322762
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