DocumentCode
3303143
Title
Development of Next Generation Environment-Friendly Soldering Technology
Author
Serizawa, Koji ; Okamoto, Masahide ; Ishihara, Shosaku ; Harada, Masahide
Author_Institution
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
fYear
2003
fDate
8-11 Dec. 2003
Firstpage
817
Lastpage
820
Abstract
The IMS project "Next Generation Environment-Friendly Soldering Technology" has been advanced with the aim of worldwide promotion of Pb-free soldering since fiscal year 2000. The objective of this project is to evaluate the impact of metals used in Pb-free solders on the human body and the environmental impact of the full life cycle of products using Pb-free solders, and also to advance production and recycle (reuse) technologies. In this report, the outline of the project and some results up to fiscal year 2002 are reported.
Keywords
contamination; environmental degradation; environmental factors; environmental testing; soldering; solders; Next Generation Environment-Friendly Soldering Technology; Pb-free soldering; human body; recycle technologies; Environmental factors; Environmental testing; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location
Tokyo, Japan
Print_ISBN
0-7803-8590-x
Type
conf
DOI
10.1109/ECODIM.2003.1322779
Filename
1322779
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