Title :
60 GHz WPAN Standardization within IEEE 802.15.3c
Author_Institution :
Oki Electr. Ind. Co, Ltd., Buford
fDate :
July 30 2007-Aug. 2 2007
Abstract :
WPAN properties are defined and the present IEEE 802.15.3, 2.4 GHz WPAN standard is briefly outlined. 60 GHz WPAN applications and environments are presented. Presently available low-cost 60 GHz semiconductor integrated circuits are shown. Millimeter wave frequency bands and Regulatory bodies are discussed. Finally, a chronology of 60 GHz WPAN standardization activity is presented.
Keywords :
IEEE standards; monolithic integrated circuits; personal area networks; wireless LAN; IEEE 802.15.3c; WPAN standardization; frequency 60 GHz; millimeter wave frequency bands; regulatory bodies; semiconductor integrated circuits; Europe; Frequency; Germanium silicon alloys; Physical layer; Proposals; Silicon germanium; Standardization; Standards publication; Streaming media; USA Councils;
Conference_Titel :
Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-1448-2
Electronic_ISBN :
1-4244-1449-0
DOI :
10.1109/ISSSE.2007.4294424
